JPS5010351A - - Google Patents
Info
- Publication number
- JPS5010351A JPS5010351A JP6085473A JP6085473A JPS5010351A JP S5010351 A JPS5010351 A JP S5010351A JP 6085473 A JP6085473 A JP 6085473A JP 6085473 A JP6085473 A JP 6085473A JP S5010351 A JPS5010351 A JP S5010351A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6085473A JPS5010351A (en]) | 1973-06-01 | 1973-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6085473A JPS5010351A (en]) | 1973-06-01 | 1973-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5010351A true JPS5010351A (en]) | 1975-02-03 |
Family
ID=13154371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6085473A Pending JPS5010351A (en]) | 1973-06-01 | 1973-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5010351A (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5688481A (en) * | 1979-12-21 | 1981-07-17 | Mitsubishi Petrochem Co Ltd | Easily releasable heat-sealing material |
| JPH05175259A (ja) * | 1991-12-25 | 1993-07-13 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物のタブレットの製造方法 |
-
1973
- 1973-06-01 JP JP6085473A patent/JPS5010351A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5688481A (en) * | 1979-12-21 | 1981-07-17 | Mitsubishi Petrochem Co Ltd | Easily releasable heat-sealing material |
| JPH05175259A (ja) * | 1991-12-25 | 1993-07-13 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物のタブレットの製造方法 |